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US 5,710,456 AGranted
Silver spot/palladium plate lead frame finish
AssigneeTexas Instruments Incorporated
InventorsDonald C. Abbott, Robert M. Fritzsche
Life of this patent
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Abstract
A lead frame is plated with palladium and then selected portions of the lead frame leads are spot plated with silver to improve solderability.
Claims7
A lead frame for a semiconductor device including a device mounting pad and lead frame leads, said lead frame comprising:
- a copper base metal;
- an intermediate plating layer plated entirely over said copper base metal comprising nickel or palladium;
- and
- a plurality of silver spot layers selectively plated over said intermediate plating layer at selected places on said lead frame leads close to the device mounting pad.
1 more element
Dependencies are inferred from the claim text.