Electronic module with low impedance ground connection using flexible circuits

An electromagnetic interference module providing a low impedance ground path for at least one capacitor on a printed circuit board thereof, said module comprising:

• a chassis having opposed sidewalls as a ground source;
• a rigid flex printed circuit board constructed of multiple circuit layers including flexible and rigid circuit layers, said board being formed with at least one rigid portion having both flexible and rigid circuit layers and at least one flexible portion constructed of at least one flexible circuit layer, wherein at least one capacitor to be grounded is located on a rigid portion of said board, wherein a flexible portion of said printed circuit board extends through a ferrite core of said module, said ferrite core being supported in a ferrite core holder secured to said chassis, and wherein a flexible circuit layer of said rigid flex printed circuit board is used as a return making a direct ground path from the rigid flex printed circuit board to a sidewall of said chassis for grounding said capacitor.

A method of assembling an electronic module wherein at least one electrical component on a printed circuit board of the module is provided with a low impedance ground path, said method comprising providing a chassis for supporting a rigid flex printed circuit board;

• and supporting a rigid flex printed circuit board constructed of multiple circuit layers including flexible and rigid circuit layers on said chassis, said board being formed with at least one rigid portion having both flexible and rigid circuit layers and at least one flexible portion constructed of at least one flexible circuit layer, at least one electrical component to be grounded being located on a rigid portion of said board, and wherein a flexible circuit layer of said rigid flex printed circuit board is contacted with and connected to said chassis as a return making a direct ground path from the rigid flex printed circuit board to the chassis for grounding said electrical component.