Solder bonded electronic module

An electronic module comprising:

• a printed circuit board populated with a plurality of heat-generating electronic components,
• wherein each heat-generating electronic component overlies a plurality of thermal vias extending through the printed circuit board;
• a mounting plate including a metal baseplate having an electrically insulating layer thereon;
• and
• a plurality of thermal attachment pads at selected locations on the electrically insulating layer thermally coupling the plurality of heat-generating electronic components to the mounting plate,
• wherein each of the plurality of thermal attachment pads is bonded to the plurality of thermal vias by a solder layer, and
• wherein the plurality of thermal attachment pads attach the printed circuit board to the mounting plate.

An electronic module comprising:

• a multi-layer printed circuit board having a device surface opposite a mounting surface;
• a plated via extending through the multi-layer printed circuit board from the device surface to the mounting surface;
• a heat-generating electronic component attached to the plated via;
• an aluminum mounting plate having a thermally conductive, electrically insulating material thereon;
• a solderable metal layer overlying the thermally conductive, electrically insulating material;
• and
• a solder layer overlying the solderable metal layer,
• wherein the solder layer thermally couples the plated via to the copper layer, and
• wherein the solder layer attaches the multi-layer printed circuit board to the aluminum mounting plate.