Puncture-resistant electrostatic chuck with flat surface and method of making the same
AssigneePackard Hughes Interconnect Company
InventorsHaim Feigenbaum, Bao Le, Randy Lee Thomas, Dong Vo
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AssigneePackard Hughes Interconnect Company
InventorsHaim Feigenbaum, Bao Le, Randy Lee Thomas, Dong Vo
Estimating the term…
The invention includes a puncture-resistant electrostatic chuck with a flat surface and a method of making the same. The electrostatic chuck includes a conductive layer such as copper foil that is laminated to a first insulation layer such as a polyimide. A puncture-resistant layer is placed over the conductive layer and includes random or woven fibers held together by a resin. The puncture-resistant layer has an uneven topography on a top surface due to the fibers contained therein. A second insulation layer overlies the puncture-resistant layer and has a top surface which is substantially flat. The flat top surface of the second insulation layer is made by laminating layers together with a mandrel which is polished and free of irregularities such as pits, dents and high spots. Preferably the mandrel has a uniform thickness over its entire surface.
An electrostatic chuck for plasma etching apparatus comprising a conductive layer, a puncture-resistant layer comprising a plurality of fibers impregnated within a resin wherein a top surface of the puncture-resistant layer has an irregular rough topography including high spots and depressions associated with the plurality of fibers, said conductive layer and puncture-resistant layer being encapsulated in an insulative layer, the insulative layer having an upper surface of which a substantial portion is flat, planar and substantially free of irregularities.
A method of making an electrostatic chuck providing a conductive layer, placing a puncture-resistant layer at least over a portion of the conductive layer wherein the puncture-resistant layer comprises a plurality of fibers impregnated in the resin and wherein the puncture-resistant layer includes a top surface having a rough irregular topography including high portions and depressions associated with the plurality of fibers, placing an insulative layer over the puncture-resistant layer and forcing a mandrel having a polished surface free of irregularities against the insulative layer under sufficient temperature and pressure to produce a top surface in the insulative layer which is smooth and free of irregularities such as pits, dents and high spots.
Dependencies are inferred from the claim text.