Semiconductor device having contoured package body profile

A semiconductor device comprising:

• a semiconductor die mounted upon a surface of a carrier substrate and electrically connected thereto;
• and
• a plastic package body formed over the surface of the carrier substrate and over the semiconductor die, the plastic package body being contoured such that the plastic package body has a first major surface overlying a portion of the carrier substrate on a first plane and a second major surface overlying the semiconductor die on a second plane, and such that in a cross-section of the semiconductor device, a first thickness of the plastic package body above the surface of the carrier substrate is less than a second thickness of the plastic package body above the semiconductor die.

A semiconductor device comprising:

• a semiconductor die mounted upon a surface of a carrier substrate and electrically coupled thereto;
• and
• a molded plastic package body overlying the surface of the carrier substrate and the semiconductor die, the plastic package body being contoured so as to have a substantially uniform thickness over the surface of the carrier substrate and over the semiconductor die.