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US 5,708,298 AGranted
Semiconductor memory module having double-sided stacked memory chip layout
AssigneesHitachi, Ltd., Hitachi Tobu Semiconductor, Ltd., Akita Electronics Co., Ltd.
InventorsWatanabe Masayuki, Sugano Toshio, Tsukui Seiichiro, Ono Takashi, Wakashima Yoshiaki
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Abstract
In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.
Claims11
A semiconductor memory module comprising:
- (a) a substrate having a plurality of wirings, a terminal, a first surface and a second surface opposite to said first surface;
- (b) a first device disposed on said first surface of said substrate, said first device having a semiconductor memory chip and first leads, said first leads being electrically connected to said semiconductor memory chip;
- (c) a second device disposed on said second surface of said substrate, said second device having a semiconductor memory chip and second leads, said second leads being electrically connected to said semiconductor memory chip;
- and
- (d) a third device disposed on said first surface of said substrate and having third leads, a first one of said third leads being electrically connected to one of said first leads of said first device by a first one of said plurality of wirings, a second one of said third leads being electrically connected to one of said second leads of said second device by a second one of said plurality of wirings, a third one of said third leads being electrically connected to said terminal of said substrate by a third one of said plurality of wirings,
- wherein said third device inputs a predetermined signal to said first and second devices, and wherein said first and second devices are positioned across from one another on either side of the substrate, such that a distance between said first and third device is substantially equal to a distance between said second and third device.
3 more elements
A semiconductor memory module comprising:
- (a) a substrate having a plurality of wirings, a terminal, a first surface and a second surface opposite to said first surface;
- (b) a first device disposed on said first surface of said substrate, said first device having a semiconductor memory chip and first leads, said first leads being electrically connected to said semiconductor memory chip;
- (c) a second device disposed on said second surface of said substrate, said second device having a semiconductor memory chip and second leads, said second leads being electronically connected to said semiconductor memory chip;
- and
- (d) a third device disposed on said first surface of said substrate and having third leads, a first one of said third leads being electrically connected to one of said first leads of said first device by a first one of said plurality of wirings, a second one of said third leads being electrically connected to one of said second leads of said second device by a second one of said plurality of wirings, a third one of said third leads being electrically connected to said terminal of said substrate by a third one of said plurality of wirings,
- wherein said third device inputs a predetermined signal to said first and second devices, and wherein said first and second devices are positioned on respective said first and second surfaces such that they are symmetrical with regard to said substrate.
3 more elements
Dependencies are inferred from the claim text.