Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same

A resin sealed semiconductor device comprising:

• outer frames for surrounding a predetermined space;
• a die pad disposed in the space surround by the outer frames;
• a semiconductor chip having electrodes to be mounted on the die pad;
• a plurality of leads extending from the outer frames to the vicinity of the electrodes of the semiconductor chip;
• connecting members for connecting the leads with the electrodes of the semiconductor chip;
• at least two support members extending from the die pad to positions away from the outer frames by a predetermined distance and each having a free tip portion;
• at lease one insulating member for connecting each of the support members with at least one of the plural leads;
• and
• a resin member for sealing an area including the die pad, the semiconductor chip, part of each of the plural leads, the connecting members, the support members and the insulating member, wherein the free tip portion is buried in the resin member.

A lead frame comprising:

• a die pad for mounting a semiconductor chip having plural electrodes;
• a plurality of inner leads extending in such a fashion that tip portions of the inner leads are in the vicinity of respective positions where the electrodes of the semiconductor chip are to be formed;
• a plurality of outer leads extending outward which are formed to be respectively continuous with the plurality of inner leads;
• a dam bar for connecting and fixing the plurality of outer leads;
• a support member extending from the die pad and having a free tip portion at a predetermined distance from the dam bar so that a given space is present between the dam bar and the support member;
• and
• an insulating member for connecting the free tip portion of the support member with at least one of the plurality of inner leads.

A lead frame for packaging a semiconductor chip including first, second, third and fourth sides and first, second, third and fourth electrode groups in the vicinity of the respective first-to-fourth sides, each group being composed of plural electrodes,

• a die pad for mounting the semiconductor chip;
• first, second, third and fourth inner lead groups, each group being composed of plural inner leads, extending to the vicinity of respective positions where the first-to-fourth sides of the semiconductor chip are to be formed and being aligned at tips along respective lines parallel to the first-to-fourth sides of the semiconductor chip;
• a frame member forming a ring in the shape of a rectangle composed of first, second, third and fourth outer frames which are connected to one another and arranged nearly parallel to the respective first-to-fourth sides of the semiconductor chip, connecting portions of the first-to-fourth outer frames forming respective corners of the rectangle;
• first, second, third and fourth outer groups which are respectively connected to the first-to-fourth outer frames, each group being composed of plural outer leads extending toward the frame member;
• a dam bar for connecting and fixing the outer leads;
• a support member extending from the die pad toward the corner of the frame member and having a free tip portion at a predetermined distance from the dam bar so that a given space is present between the dam bar and the support member;
• and
• an insulating member for connecting the support member with at least one of the plural inner leads,
• wherein at least one group out of the first-to-fourth inner lead groups includes an inner lead extending across the given space between the dam bar and the support member to be connected to an outer lead of one group out of the first-to-fourth outer lead groups which is connected to one outer frame out of the first-to-fourth outer frames which is adjacent to a different outer frame which is arranged nearly parallel to the group of inner leads.

A semiconductor device comprising:

• a die pad;
• a semiconductor chip in the shape of a rectangle having first, second, third and fourth sides, which is mounted on the die pad;
• first, second, third and fourth electrode groups respectively located in the vicinity of the first-to-fourth sides of the semiconductor chip, each group being composed of plural electrodes;
• first, second, third and fourth inner lead groups, each group being composed of plural inner leads, being aligned at tips along respective lines parallel to the first-to-fourth sides in the vicinity of the electrodes of the semiconductor chip;
• a plurality of connecting members for connecting the plural inner leads with the plural electrodes, respectively;
• first, second, third and fourth outer lead groups, each group being composed of plural outer leads, being aligned at tips along respective lines parallel to the first-to-fourth sides of the semiconductor chip, the tips forming an approximate rectangle;
• a resin member for sealing an area including the die pad, the inner leads and the connecting members;
• a support member extending from the die pad to a position at a predetermined distance from a corner of the approximate rectangle formed by the tips of the first-to-fourth outer lead groups and having a free tip portion buried in the resin member;
• and
• an insulating member for connecting the support member with at least one of the plural inner leads,
• wherein most inner leads of one group out of the first-to-fourth inner lead groups are respectively connected to outer leads of one group out of the first-to-fourth outer lead groups which is labelled with the same ordinal number as the inner lead group, and at least one inner lead out of the inner lead group is connected to one outer lead of a different outer lead group which is adjacent to the outer lead group labelled with the same ordinal number as the inner lead group.