Integrated electro-optical package and method of fabrication

A dual sided opto-electronic device comprising:

• a substrate having a first major surface and an opposed second major surface;
• an array of light emitting devices formed on the first major surface of the substrate, comprised of a plurality of layers of material including at least a conductive layer of semiconductor material supported by the first major surface of the substrate, a first carrier confinement layer on the conductive layer, an active layer on the first carrier confinement layer, and a second carrier confinement layer on the active layer;
• and
• at least one vertical cavity surface emitting laser formed on the opposed second major surface of the substrate, including a first mirror stack formed on the opposed second major surface of the substrate and parallel therewith, a first cladding region formed on the first mirror stack, an active region formed on the first cladding region, a second cladding region formed on the active region, a second stack formed on the second cladding region having formed therein an etch stop layer, and a metal layer formed on the second mirror stack, etched to define an emitting area.