Electron-beam exposure device and a method of detecting a mark position for the device

A method of detecting a position of a position-detection mark in an electron-beam exposure device which has at least one deflector for deflecting an electron beam and a plurality of detectors for detecting scattered electrons from said position-detection mark when said electron beam is positioned on said position detection mark, said method comprising the steps of:

• a) detecting said scattered electrons by using said detectors;
• b) amplifying an output of each of said detectors by a corresponding amplification factor so as to obtain said output having a constant magnitude independent of a deflected position of said electron beam;
• c) adding for all of said detectors said output having a constant magnitude to obtain an added signal;
• and
• d) analyzing a form of said added signal to detect said position of said position-detection mark.

A method of detecting a position of a position-detection mark in an electron-beam exposure device which has at least one deflector for deflecting an electron beam and at least one detector for detecting scattered electrons from said position-detection mark when said electron beam is positioned on said position detection mark, said position-detection mark comprising at least one groove formed on a reference chip, said method comprising the steps of:

• a) positioning said electron beam on said position-detection mark by scanning said electron beam with said at least one deflector;
• b) measuring an output of said at least one detector, said output being free from an effect of electrons scattered by a side wall of an edge of said position-detection mark;
• and
• c) detecting a position of said edge by analyzing an edge signal of said edge appearing in said output.

A method of detecting a position of a position-detection mark in an electron-beam exposure device which has at least one deflector for deflecting an electron beam and a plurality of detectors for detecting scattered electrons from said position-detection mark when said electron beam is positioned on said position detection mark, said position-detection mark comprising at least one groove formed on a reference chip, said method comprising the steps of:

• a) positioning said electron beam on said position-detection mark by scanning said electron beam with said at least one deflector;
• b) measuring outputs of said detectors, said outputs being free from an effect of electrons scattered by a side wall of an edge of said position-detection mark;
• c) adding said outputs to obtain an added output;
• and
• d) detecting a position of said edge by analyzing an edge signal of said edge appearing in said added output.

An electron-beam exposure device having at least one deflector for deflecting an electron beam within a deflection field, and detecting a position of a position-detection mark with said electron beam, said electron-beam exposure device comprising:

• a reference chip having an upper surface and a lower surface, said upper surface having a position-detection mark for calibrating a deflected position of said electron beam within said deflection field;
• a chip holder holding said reference chip by having a fixed contact with said lower surface of said reference chip, said chip holder having a step-form portion lower than said lower surface of said reference chip;
• a wafer holder having an upper surface and a first recess for storing said chip holder, said first recess having a bottom surface, an opening continuing to said upper surface, and a stopper surface located beneath said upper surface around said opening;
• and
• a spring provided between said bottom surface of said first recess and said chip holder to urge said step-form portion of said chip holder against said stopper surface such that said upper surface of said reference chip is flush with said upper surface of said wafer holder.

An electron-beam exposure device having at least one deflector for deflecting an electron beam within a deflection field, and detecting a position of a position-detection mark with said electron beam, said electron-beam exposure device comprising:

• a reference chip having an upper surface and a lower surface, said upper surface having a position-detection mark for calibrating a deflected position of said electron beam within said deflection field;
• a chip holder holding said reference chip by having a fixed contact with said lower surface of said reference chip;
• a wafer holder having an upper surface and a first recess for storing said chip holder, said first recess having a bottom surface and an opening continuing to said upper surface;
• and
• a screw fixedly mounting said chip holder to said bottom surface of said first recess such that said upper surface of said reference chip is flush with said upper surface of said wafer holder.

A method of exposing a predetermined pattern on a wafer by using an electron-beam exposure device which has at least one detector for detecting scattered electrons from a position-detection mark when said electron beam is positioned on said position detection mark, said method comprising the steps of;

• forming a reference chip integrally with a chip holder, said reference chip having a first position-detection mark on an upper surface thereof for calibrating a deflected position of said electron beam within a deflected field;
• fixedly mounting said chip holder in a first recess of a wafer holder so that said upper surface of said reference chip is flush with an upper surface of said wafer holder;
• detecting a position of said first position-detection mark by detecting electrons scattered from said first position-detection mark;
• calibrating said deflected position of said electron beam within said deflected field based on said position of said first position-detection mark;
• fixedly mounting said wafer in a second recess of said wafer hold, an upper surface of said wafer being urged against stoppers fixed on said upper surface of said wafer holder such that said upper surface of said wafer is flush with said upper surface of said wafer holder, said wafer having a second position-detection mark on said upper surface thereof;
• detecting a position of said second position-detection mark by detecting electrons scattered from said second position-detection mark, said stoppers being arranged such that said electrons scattered from said second position-detection mark are free from obstruction before reaching said at least one detector;
• aligning said wafer with said electron beam based on said position of said second position-detection mark;
• and
• drawing said predetermined pattern on said upper surface of said wafer by using said electron beam.