Heat resistant organopolysiloxane composition

Abstract

There is disclosed a heat resistant organopolysiloxane composition comprising: (A) 100 parts by weight of an organopolysiloxane having a viscosity of 100 to 1,000,000 centistokes at 25.degree. C.; (B) 0.001 to 10 parts by weight of a reaction product of an alkali metal silanolate compound with cerium chloride or a cerium carboxylate; and (C) a diorganopolysiloxane having silicon-bonded hydrogen groups only at its molecular chain terminals, component (C) being present in a quantity sufficient to provide 1 to 10,000 parts per million of silicon-bonded hydrogen based on the total weight of said composition.

Dependencies are inferred from the claim text.