Hot melt epoxy encapsulation material

An electronic assembly having a substrate with a conductive member, the electronic assembly comprising:

• a surface mount integrated circuit device mounted to the substrate;
• a lead extending from the surface mount integrated circuit device and in electrical contact with the conductive member;
• solder bonding the lead to the conductive member so as to form a solder joint;
• and
• an encapsulation material encapsulating the solder joint, the encapsulation material being formed from a reactive hot melt material characterized by being a solid or semisolid at approximately room temperature, being a liquid at an elevated application temperature of about 45.degree. to about 90.degree. C. at which the encapsulation material is applied to the solder joint, and resolidifying upon cooling to room temperature so as to enable immediate handling of the electronic circuit assembly, the encapsulation material comprising at least two epoxy materials and a latent curative that triggers curing at a temperature of less than 150.degree. C., a first epoxy of the at least two epoxy materials being a solid or semisolid at room temperature, a second epoxy of the at least two epoxy materials being a solid, semisolid or liquid at room temperature, the encapsulation material further comprising a filler material so as to have a coefficient of thermal expansion of about 25 to about 35 ppm/.degree. C., the encapsulation material having a viscosity of not more than about 5000 centipoise at the elevated application temperature.