Bonding pad structure and method thereof

A method for forming integrated circuit device including a bonding pad with an anchor structure, the method comprising:

• forming a conducting layer over a substrate;
• removing a portion of said conducting layer to form first and second individual anchor pads in the conducting layer;
• forming a first dielectric layer over and between said first and second individual anchor pads;
• forming a first via through said first dielectric layer and contacting said first individual anchor pad, said first via having a smaller cross-sectional area than said first individual anchor pad;
• forming a second via through said first dielectric layer and contacting said second individual anchor pad;
• said second via having a smaller cross-sectional area than said second individual anchor pad;
• and
• placing conducting material above said first dielectric layer and within said first and second vias to contact said first and second individual anchor pads,
• wherein a lower portion of said conducting material contacts said first and second individual anchor pads and an upper portion of said conducting material connects both said first and said second anchor pads to an external contact.