Method of making a circuitized substrate using two different metallization processes

A method of making a circuitized substrate comprising the steps of:

• providing a dielectric member including at least one dielectric layer having a first layer of electrically conductive material thereon;
• forming a first electrically conductive member on said at least one dielectric layer of said dielectric member from said first layer of electrically conductive material using a first metallization process wherein some of said first layer of electrically conductive material is removed;
• providing a second layer of electrically conductive material on said at least one dielectric layer including on said first electrically conductive member:
• providing a second dielectric layer on said second layer of electrically conducting material and thereafter removing portions of said second dielectric layer to expose portions of said second layer of electrically conductive material, including over said first electrically conductive member;
• and
• forming second electrically conductive members on said exposed portions of said second layer of said electrically conductive material using a second metallization process different from said first metallization process wherein electrically conductive material is added to said exposed portions of said second layer of electrically conductive material, including onto said second layer of electrically conductive material over said first electrically conductive member, thereby providing said circuitized substrate.