Hermetically sealed radiation imager

Abstract

A hermetically packaged radiation imager includes a moisture barrier cover disposed over the imaging array and a hermetic seal structure disposed around the periphery of the moisture barrier cover to seal the cover to the underlying substrate. The hermetic seal structure comprises a solder seal disposed in contact with the moisture barrier cover and a dielectric material layer disposed between the solder seal and conductive lines extending from the imager array across the substrate surface. The hermetic seal structure further includes a primer layer that is disposed between the dielectric material layer and the solder seal to provide a foundation to which the solder seal adheres. The dielectric material layer is deposited in an atomic layer epitaxy technique, thus providing a thin layer having high structural integrity.

Dependencies are inferred from the claim text.