Method for producing thin film multilayer wiring board

A thin film multilayer wiring material which comprises an insulation organic film having a wiring pattern layer on one principal surface and an adhesive layer on another principal surface;

• said insulation organic film being a polyimide film having a repeating structure represented by the following formula:
• ##STR7## wherein X represents an aromatic diamine residue and the adhesive layer contains an ether bismaleimide compound represented by the following formula:
• ##STR8## wherein R.sub.1 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, R.sub.2 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, m represents an integer of 1 to 4, and R.sub.3 and R.sub.4 each represents CH.sub.3 or CF.sub.3 and may be identical with or different from each other.