Adhesive for semiconductor device and reinforcing material using the same
AssigneeTomoegawa Paper Co., Ltd.
InventorsTadahiro Oishi, Akira Tezuka
Life of this patent
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Abstract
An adhesive for bonding a reinforcing sheet to a lead-formed surface of a tape carrier package used for forming a semiconductor device, the adhesive being a resin composition which constitutes an interlayer between the lead-formed surface and the reinforcing sheet, comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin, is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150.degree. C., has high insulation reliability after cured, and has heat resistance against a temperature up to 260.degree. C.
Claims7
A reinforcing material for a tape carrier package used for forming a semiconductor device,
- the reinforcing material being a reinforcing sheet formed of a metal foil to be laminated on a lead-formed surface of the tape carrier package,
- the reinforcing sheet formed of a metal foil having an adhesive layer to bond the said sheet to the lead-formed surface,
- the adhesive layer being composed of a composition containing 100 parts by weight of a polyamide resin, 9 to 88 parts by weight of an epoxy resin and 5 to 60 parts by weight a phenolic resin, the polyamide resin having an amine value of 3.0 to 50.
Dependencies are inferred from the claim text.