Method of producing coatings on electronic substrates
AssigneeDow Corning Corporation
InventorsJeffrey Nicholas Bremmer, Youfan Liu
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Abstract
This invention pertains to a method for producing an insoluble coating on a substrate by curing a composition comprising hydrogen silsesquioxane at a temperature of 375.degree. C. or less for a time sufficient to produce a coating having >80% SiH. It has been found that when the hydrogen silsesquioxane resin is cured at a temperature of 375.degree. C. or less that that the insoluble SiH containing coating shows improved film stress.
Claims13
A method of forming an insoluble coating on a substrate wherein said method comprises
- (A) coating the substrate with a coating composition comprising a soluble hydrogen silsesquioxane resin having silicon-bonded hydrogen to form a soluble hydrogen silsesquioxane resin coating on the substrate;
- (B) heating the soluble hydrogen silsesquioxane resin coating to a temperature of 375.degree. C. or less for a period of time sufficient to convert the hydrogen silsesquioxane resin coating into an insoluble final coating retaining in the insoluble final coating >80% of the silicon-bonded hydrogen from the soluble hydrogen silsesquioxane resin.
The method as claimed in 7 wherein the catalyst is present in an amount sufficient to provide 5 to 1000 ppm platinum, rhodium or copper based on the weight of the hydrogen silsesquioxane resin.
Dependencies are inferred from the claim text.