Heated nozzle manifolds in a common plane interconnected through connector manifolds
AssigneeMold-Masters Limited
InventorChun Keung Mak
Life of this patent
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AssigneeMold-Masters Limited
InventorChun Keung Mak
Estimating the term…
Injection molding apparatus with a central heated manifold, a pair of connector manifolds, and at least four nozzle manifolds mounted to extend in a common plane in a mold. A number of heated nozzles extend from each nozzle manifold. A melt passage branches in each nozzle manifold and the nozzle manifolds are made so thermal expansion slides the branches of the melt passage into exact alignment with central melt bores through the nozzles. The central manifold and the two connector manifolds extend along a central axis and each connector manifold is between each pair of nozzle manifolds which are offset from the central axis. Connector bushings slidably connect each connector manifold rearwardly to the central manifold and sidewardly to each nozzle manifold. The connector bushings slide sufficiently to provide sufficient compensation for thermal expansion and contraction to allow either the connector manifolds or the nozzle manifolds to be centrally located relative to the cooled mold, which reduces the distances the melt passage branches must slide to be in proper alignment.
In an injection molding apparatus having a heated central manifold and a plurality of heated nozzle manifolds mounted in a mold with a melt passage branching in the central manifold for conveying melt through the nozzle manifolds from a central inlet in the central manifold to a plurality of heated nozzles extending from each nozzle manifold, each nozzle seated in the mold with a central melt bore extending in alignment with a gate leading to a cavity, the improvement wherein;
Dependencies are inferred from the claim text.