Apparatus and method for removing known good die using hot shear process
AssigneeInternational Business Machines Corporation
InventorsDavid Charles Olson, Robert Phillips, III
Life of this patent
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Abstract
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
Claims16
A process for separating an active or passive device from a device carrier, said process comprises:
- (a) securing a removing means to said device, wherein said device is secured to said device carrier by at least one solder ball,
- (b) securing at least a portion of at least one bimetallic strip to said removing means, and wherein at least a portion of said bimetallic strip is in contact with said device, and wherein said at least one bimetallic strip clamps onto said device when said bimetallic strip is heated,
- (c) placing said device carrier along with said device and said removing means onto a housing such that said removing means provides a pulling motion to said device,
- (d) placing said housing in a thermal environment and heating said device until said solder reaches the solder liquidus temperature, whereupon said removing means pulls said device away from said device carrier, thereby separating said device from said device carrier.
A process for separating an active or passive device from a device carrier, said process comprises:
- (a) securing a removing means to said device, wherein said device is secured to said device carrier by at least one solder ball, and wherein said removing means has a ledge to align and secure one edge of said device,
- (b) placing said device carrier along with said device and said removing means onto a housing such that said removing means provides a pulling motion to said device,
- (c) placing said housing in a thermal environment and heating said device until said solder reaches the solder liquidus temperature, whereupon said removing means pulls said device away from said device carrier, thereby separating said device from said device carrier.
Dependencies are inferred from the claim text.