Method of assembling integrated circuit package
AssigneeRJR Polymers, Inc.
InventorRichard J. Ross
Life of this patent
Estimating the term…
Abstract
An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contains a thermally conductive filler material. With the lid in place over the die and substrate board, the package is heated to cause the resin to flow and establish contact with the die. Further heating causes curing of the resin and a permanent thermal bridge between the die and the lid.
Claims6
A method of assembling an integrated circuit package comprising a substrate bearing a printed circuit, a die mounted to said substrate and containing an integrated circuit, and a protective metal lid covering said die and dissipating heat generated by said die, said method comprising:
- (a) securing said die to said substrate with conductive leads on said die in electrical contact with said printed circuit;
- (b) covering said die thus secured with a concave metal lid, said lid having a concave inner surface to which is adhered a thermoplastic heat-curable resin containing an thermally conductive filler material;
- and
- (c) heating said substrate, die and lid as assembled according to steps (a) and (b), to cure said heat-curable resin and thereby bond said heat-curable resin to both said lid and said die.
Dependencies are inferred from the claim text.