Method for producing a three-dimensional circuit arrangement
AssigneeSiemens Aktiengesellschaft
InventorHolger Hubner
Life of this patent
Estimating the term…
Abstract
Substrates (11, 12) each of which having components with contacts (13, 14) are arranged one above the other in a stack in order to produce a three-dimensional circuit arrangement. Metal surfaces (20) are applied onto that main surface (15) of at least one of the substrates (11) which is adjacent to the other substrate, which metal surfaces (20) are soldered to the adjacent main surface (17) of the other substrate (12) in order to produce the mechanical joint between the two substrates (11, 12). The components can be tested before the application of further substrates, and substrates having faulty components are removed by grinding away into the metal surfaces (20).
Claims14
A method for producing a three-dimensional circuit arrangement, comprising the steps of:
- providing at least a first substrate and a second substrate, each of said first and second substrates having at least one component;
- arranging above one another in a stack the first substrate and the second substrate;
- applying main metal surfaces onto a main surface of at least one substrate of the first and second substrates which is adjacent to the other substrate of the first and second substrate;
- soldering the main metal surfaces to an adjacent main surface of the other substrate by application of solder metal and heating, the solder metal mixing completely with a material of the main metal surfaces so that an intermetallic phase is formed, and a firm joint is produced between the first substrate and the second substrate;
- matching the material of the main metal surfaces and the solder metal to one another such that a melting temperature of the intermetallic phase is higher than an operating temperature of the three-dimensional circuit arrangement and is higher than a melting temperature of the pure solder metal;
- forming insulating trenches between the main metal surfaces and adjacent contacts which are arranged on a common main surface.
Dependencies are inferred from the claim text.