No fixture method to cure die attach for bonding IC dies to substrates
AssigneeTexas Instruments Incorporated
InventorLinden T. Halstead
Life of this patent
Estimating the term…
Abstract
A no fixture method to cure die attach for bonding IC dies (16) to substrates in which a solvent is applied to top and bottom surfaces of a thermoplastic die attach film (14), prior to component placement of the die (16) on a lead frame die support pad or on a printed circuit board PCB (12). The die attach film (14) is bonded to the IC die (16) and the lead frame, or to the IC die (16) and the printed circuit board PCB (12) upon drying of the solvent.
Claims16
A no fixture method to cure die attach for bonding IC dies to substrates, comprising:
- providing a substrate;
- providing a die attach film;
- coating both sides of said die attach film with a solvent to soften said die attach film;
- placing said solvent coated die attach film on said substrate;
- placing a semiconductor die on said solvent coated die attach film;
- and allowing said solvent to dry.
A no fixture method to cure die attach for bonding IC dies to substrates, comprising:
- providing a substrate;
- providing a die attach film;
- coating a portion of said substrate with a solvent capable of softening said die attach film;
- coating the backside of a semiconductor die with a solvent capable of softening said die attach film;
- placing said die attach film on said substrate;
- placing said solvent coated semiconductor die on said die attach film;
- and allowing said die attach film to dry.
A no fixture method to cure die attach for bonding IC dies to substrates, comprising:
- providing a substrate;
- providing a die attach film;
- coating a portion of said substrate with a solvent capable of softening said die attach film;
- placing said die attach film on said coated portion of said substrate;
- coating the exposed portion of said die attach film with a solvent capable of softening said die attach film;
- placing a semiconductor die on said solvent coated die attach film;
- and
- allowing said solvent to dry.
Dependencies are inferred from the claim text.