Ball grid array integrated circuit package that has vias located within the solder pads of a package

An integrated circuit ball grid array package, comprising:

• a substrate that has a first surface and a second opposite surface;
• an elliptical solder pad located on said first surface of said substrate, said elliptical solder pad having a major diameter and a minor diameter;
• a solder mask located on said first surface, said solder mask having an opening that exposes said elliptical solder pad and which has a diameter equal to said minor diameter of said elliptical solder pad so that a portion of said elliptical solder pad is covered by said solder mask;
• a solder ball that is attached to said elliptical solder pad;
• and,
• an integrated circuit that is mounted to said second surface of said substrate and coupled to said elliptical solder pad.

A method for constructing an electronic package, comprising the steps of:

• a) forming an elliptical solder pad on a first surface of a substrate, wherein said elliptical solder pad has a minor diameter and a major diameter;
• b) forming a solder mask on said first surface of said substrate so that said solder mask has an opening that exposes said elliptical solder pad, said opening having a diameter equal to said minor diameter of said elliptical solder pad so that a portion of said elliptical solder pad is covered by solder mask;
• and,
• c) attaching a solder ball to said elliptical solder pad.