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US 5,706,172 AGranted
Stacked semiconductor package having supporting bars and a socket therefor
AssigneeSamsung Electronics Co., Ltd.
InventorKyu Jin Lee
Life of this patent
Estimating the term…
Abstract
A stacked semiconductor package including a plurality of semiconductor devices stacked over one another and having outer leads, which are extended from sides of the devices and bent downwardly. A plurality of supports are vertically interposed between the outer leads. The supports electrically connect the outer leads in vertical direction only.
Claims12
A stacked three-dimensional semiconductor package, comprising:
- a plurality of semiconductor devices having sides, said semiconductor devices being stacked over one another as a stack and each having a plurality of outer leads, which are extended from said sides of respective ones of said devices and bent downwardly so a to form a plurality of vertical columns thereof distributed about the periphery of said stack;
- and
- a plurality of support bars vertically interposed between said columns of said outer leads, each of said support bars electrically connecting the outer leads in only a respective same said column thereof;
- each of said being made of a conductive material, a first vertically extensive portion thereof being coated with an insulating material, and a second vertically extensive portion thereof being plated with lead (Pb) arranged to provide said electrically connecting of respective ones of said outer leads in a respective said column.
1 more element
A stacked three-dimensional semiconductor package, comprising:
- a plurality of semiconductor devices having sides, said semiconductor devices being stacked over one another as a stack and each having a plurality of outer leads, which are extended from said sides of respective ones of said devices and bent downwardly so a to form a plurality of vertical columns thereof distributed about the periphery of said stack;
- and
- a plurality of support bars vertically interposed between said columns of said outer leads, each of said support bars electrically connecting the outer leads in only a respective same said column thereof;
- each of said support bars being made of a non-conductive material, a vertically extensive portion thereof being plated with a conductive metal and with lead (Pb), in turn and arranged to provide said electrically connecting of respective ones of said outer leads in a respective said column.
1 more element
A stacked three-dimensional semiconductor package, comprising:
- a plurality of semiconductor devices having sides, said semiconductor devices being stacked over one another as a stack and each having a plurality of outer leads, which are extended from said sides of respective ones of said devices and bent downwardly so a to form a plurality of vertical columns thereof distributed about the periphery of said stack;
- and
- a plurality of support bars vertically interposed between said columns of said outer leads, each of said support bars electrically connecting the outer leads in only a respective same said column thereof;
- each of said support bars being made of a non-conductive material, and two laterally spaced vertically extensive portions thereof each being plated with a conductive metal and with lead (Pb), in turn and being respectively arranged to provide said electrically connecting of respective ones of said outer leads in respective ones of said columns.
1 more element
A stacked package socket comprising a plurality of semiconductor devices stacked over one another and having outer leads, which are extended from sides of said devices and bent downwardly;
- a circuit substrate formed with a circuit pattern;
- and a socket lid,
- said semiconductor devices being stacked by way of a plurality of supporting means, which vertically interposed between said outer leads, and electrically connect the outer leads in vertical direction only.
A stacked three-dimensional semiconductor package, comprising:
- a plurality of semiconductor devices having sides, said semiconductor devices being stacked over one another as a stack and each having a plurality of outer leads, which are extended from said sides of respective ones of said devices and bent downwardly so as to form a plurality of vertical columns thereof distributed about the periphery of said stack;
- and
- a plurality of support bars vertically interposed between columns of said outer leads, each of said support bars electrically connecting the outer leads in only a respective same said column thereof.
Dependencies are inferred from the claim text.