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US 5,705,935 AGranted
Method of managing mapping data indicative of excellent/defective chips on semiconductor wafer
AssigneeNEC Corporation
InventorKatsuhiro Nishimura
Life of this patent
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Abstract
A mapping data indicative of locations of excellent integrated circuits is printed on a label sheet, and the label sheet carrying the mapping data is bonded to a peripheral area of a semiconductor wafer so as to easily manage the mapping data.
Claims8
A method of managing a mapping data indicative of locations of acceptable products and locations of defective products on a semiconductor wafer, comprising the steps of:
- a) testing products fabricated in first sub-areas defined in a major surface of said semiconductor wafer so as to determine acceptable products and defective products;
- b) writing first marks indicative of said first sub-areas of either acceptable or defective products and a second mark indicative of a reference for determining said first sub-areas on a label separated from said semiconductor wafer;
- and
- c) fixing said label to a second sub-area on said major surface of said semiconductor wafer where on product is fabricated.
1 more element
Dependencies are inferred from the claim text.