Resuable carrier for burn-in/testing on non packaged die

A re-usable carrier for mounting a non-packaged die for burn-in and testing, comprising:

• a unitary molded insulating base having a configuration and an outer perimeter conforming to a standard integrated circuit package design, said base including integral, electrically conductive coated external terminals positioned and shaped to conform to the terminals of a standard integrated circuit package design;
• said base incorporating thin layer electrical conductors connected to said external terminals to provide electrical connection with bond pads of a non-packaged die;
• a cover removably mounted on the base;
• structure interposed between said thin layer electrical contacts and said cover to receive and position a non-packaged die on said base with bond pads of the die electrically connected with said thin layer electrical conductors;
• and means for detachably holding the cover to the base to impart a desired pressure to the non-packaged die to maintain electrical connection between the bond pads of the non-packaged die and the thin layer electrical conductors.

A re-usable carrier for mounting a non-packaged die for burn-in and testing comprising

• a molded insulating base having a configuration and outer perimeter conforming to a standard integrated circuit package design, said base including integrally formed terminals positioned on the outer perimeter and having a shape conforming to the terminals of the standard integrated circuit package design,
• a thin layer electrically conductive material coated on the integrally formed terminals of the base to form external terminal conductors for enabling electrical contact with test equipment, said thin layer electrically conductive material also forming electrical contacts on the base,
• a film including printed circuit conductors engaging the electrical contacts on the base,
• means for receiving and positioning a non-packaged die with bond pads engaging said printed conductors for enabling electrical connection between the external conductors and the bond pads of a received non-packaged die,
• a cover removably mounted on the molded base to impart a sufficient pressure to the non-packaged die for maintaining connection between the bond pads of the non-packaged die and the printed conductors on the film, and
• cover holding means for detachably holding the cover to the molded base, wherein said cover, molded base, film including printed conductors and cover holding means form a carrier having a shape and dimension substantially conforming to a standard integrated circuit package design so as to allow use with existing test equipment.