Integrated circuit for directly attaching to a glass substrate and method for manufacturing the same

An electronic device for displaying information to a user, the electronic device comprising:

• a display for presenting the information, the display including a glass substrate having conductive runners formed thereon;
• an integrated circuit (IC) for attaching to the glass substrate, the IC having cavities formed in a first surface thereof and including an integrated circuit die having circuitry included thereon, the IC comprising:
• metal layers formed adjacent to the integrated circuit die within the cavities and coupled to the circuitry;
• conductive bumps formed within the cavities to electrically couple to the circuitry via the metal layers, the conductive bumps comprising a material that adheres to glass such that the conductive bumps electrically couple the circuitry to the conductive runners of the glass substrate when heat is applied thereto;
• and
• an adhesive deposited on regions of the first surface of the IC surrounding the cavities in which the conductive bumps are formed for adhering to the glass substrate when the IC is attached thereto, thereby strengthening the bond provided by connections between the conductive bumps and the glass substrate,
• wherein the conductive bumps extend farther from the first surface of the IC than does the adhesive.