Thermal ball lead integrated package

An integrated circuit assembly, comprising:

• (a) a dielectric substrate having a top surface and a bottom surface, said top surface having a plurality of electrically conductive traces formed thereon, and said bottom surface of said substrate includes a plurality of contacts attached thereto such that said associated conductive traces on the top surface are in electrical communication with associated ones of the contacts;
• (b) leads of a lead frame including a plurality of leads of separate and distinct electrically conductive leads, said leads supported by the top surface of said substrate;
• (c) an integrated circuit die having a top surface, said die including a first and second group of bond pads and wherein the die is affixed to said top surface of the substrate;
• (d) a first group of bonding wires electrically coupling said first group of said bond pads on the die to said conductive traces on said substrate, a second group of bonding wires electrically coupling said second group of said bond pads of the die to said leads;
• (e) a molding material molded over said top surface of the substrate, a part of the die including the bond pads, the bonding wires, and a first portion of the leads such that the molding material and the top surface of the substrate cooperate to seal most of the die from the ambient environment;
• and
• (f) a heat sink integrated within said molding material, said heat sink having a first end and a second end, said first end engaging against the top surface of the die and said second end being positioned away from the top surface of the die, said heat sink including a base portion that includes said first end and a heat dissipating portion that includes said second end, said base portion supporting said heat dissipating portion at a fixed distance from the upper surface of the substrate, said heat dissipating portion extending laterally outward from the base portion so that all of the bond pads, all of the bonding wires and at least a second portion of the leads are positioned directly between the heat dissipating portion and the substrate.