Semiconductor module

A semiconductor module comprising:

• a plurality of semiconductor devices mounted on a circuit board;
• a first thermal conductor member provided for each one of said semiconductor devices to be cooled and having a first surface fixedly secured to the semiconductor device;
• a housing having a radiator for radiating heat generated by said semiconductor devices and accommodating said plurality of semiconductor devices;
• a second thermal conductor member provided for each one of said semiconductor devices to be cooled, each second thermal conductor member having a first major surface and a second major surface and having a hole, said first thermal conductor member being inserted into said hole of said second thermal conductor member;
• and a resilient member provided between a second surface said first thermal conductor member and a surface of said second thermal conductor member within said hole to bring said first major surface of said second thermal conductor member into contact with an inner surface of said housing.