Power semiconductor module having a plurality of submodules

Abstract

In the case of a power semiconductor module (34) having a plurality of submodules (37b), which are arranged next to one another on a common baseplate (35) and are electrically interconnected, and can be externally connected, on the power side in a low-inductance manner by means of conductors in the form of plates, a reduction in the space requirement is achieved by virtue of the fact that the conductors (40, 43) in the form of plates are each arranged in a self-supporting manner in planes above the submodules (37b), which planes have a vertical separation from one another and from the submodules (37b) which is sufficient for electrically insulation, and that the conductors (40, 43) in the form of plates are electrically connected to the individual submodules (37b) via additional, vertical conduction elements (38a,b ,42a-c). (FIGS. 4 and 7)

Dependencies are inferred from the claim text.