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US 5,705,540 AGranted
Inorganic filler, manufacturing method thereof, and resin composition containing an inorganic filler
AssigneeKabushiki Kaisha Toshiba
InventorsKen Uchida, Yasuyuki Hotta, Shuzi Hayase
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Abstract
Disclosed is a resin composition excellent in mechanical and electrical properties. The composition contains an inorganic filler such as fused silica or silicon nitride having the surface covered with a substance resulting from decomposition of a polysilane compound and a base resin such as an epoxy resin or a maleimide resin.
Claims8
A resin composition, comprising:
- an inorganic filler;
- and
- a base resin;
- wherein
- said filler is chemically modified with a polysilane compound having an Si--Si backbone;
- and wherein said polysilane compound is bound directly to said filler.
3 more elements
Dependencies are inferred from the claim text.