Phenolic foams having a low formaldehyde evolution
AssigneeArmstrong World Industries, Inc.
InventorsJohn J. Hartman, Jr., Ronald S. Lenox, Dean L. Putt
Life of this patent
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Abstract
Phenolic foam which can be used as insulation is a foamed phenol-formaldehyde resole resin which contains a peptide, a proteinaceous material, cysteine, glutamic acid, glycine, isoleucine, leucine, lysine, phenylalanine, serine, tryptophan, or mixtures thereof at an amount effective to reduce emission of free formaldehyde from the foamed resin.
Claims13
A phenolic foam useful as insulation comprising a foamed phenol-formaldehyde resole resin which contains a formaldehyde reducing additive which is a peptide, a proteinaceous material, cysteine, glutamic acid, glycine, isoleucine, leucine, lysine, phenylalanine, serine, tryptophan, or mixtures thereof at an amount effective to reduce emission of free formaldehyde from the foamed resin.
A process for the preparation of a phenolic foam having reduced formaldehyde emissions comprising the steps of:
- mixing a peptide, a proteinaceous material, cysteine, glutamic acid, glycine, isoleucine, leucine, lysine, phenylalanine, serine, tryptophan, or mixtures thereof at an amount effective to reduce the emission of formaldehyde, with a phenol-formaldehyde resole resin, a blowing agent at an amount in the range of from about 5 to about 40 parts by weight per hundred parts of phenol-formaldehyde resole resin, and an acid catalyst at an amount in the range of from about 3 to about 30 parts by weight per hundred parts of phenol-formaldehyde resole resin, and heating at a temperature sufficient to cause foam formation and resin curing.
Dependencies are inferred from the claim text.