US 5,705,431 AGranted

Production method for insulated semiconductor device

AssigneeNEC Corporation

InventorMotohisa Mori

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Abstract

The invention provides a production method for an insulated semiconductor device which eliminates displacement between positions of upper and lower metallic mold cavities (between upper and lower caps) when a resin is filled to achieve improvement in quality and productivity. A lead shaping apparatus for shaping inner lead portions of a flat hoop frame supplied thereto from a frame supply apparatus is located between the frame supply apparatus and a die bonding apparatus so that, before die bonding of semiconductor pellets is performed, shaping of the inner lead portions is performed. Thereafter, die bonding and wire bonding are performed for the flat hoop frame, and then, resin is filled only into a lower metallic mold cavity by a resin filling apparatus to embed the inner lead portions in the resin.

Claims6

Dependent claims

A production method for an insulated semiconductor device, comprising the steps of:

forming a flat hoop frame having a plurality of rows of sets of leads such that inner lead portions of the leads extend farther than corresponding resin filling centers so that outer lead portions of the leads may be positioned at predetermined positions with respect to outer profiles of semiconductor devices after resin is filled and supplying the flat hoop frame from a frame supply apparatus;
shaping the inner lead portions of the leads of the flat hoop frame simultaneously for the plurality of rows and for a plurality of pitches by a lead shaping apparatus;
performing die bonding of semiconductor pellets and wire bonding for the flat hoop frame;
and
filling, for each set of leads, resin into one of two cavities by a resin filling apparatus so that the outer lead portions of the leads of the flat hoop frame may be positioned at the predetermined positions with respect to the outer profiles of the semiconductor devices after the resin is filled.

2 more elements

Dependencies are inferred from the claim text.