Method for making improved pillar structure for field emission devices
AssigneeLucent Technologies Inc.
InventorsEdwin Arthur Chandross, Sungho Jin, Gregory Peter Kochanski, John Thomson, Jr., Wei Zhu
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Abstract
The pillar structure according to the invention has a substantially longer surface path length from negative to positive electrodes resist breakdown in a high voltage environment. The processing and assembly methods in this invention permit low-cost manufacturing of high breakdown-voltage, dielectric pillars for the flat panel display.
Claims3
A method for making an electron field emission device comprising an emitter cathode electrode, a anode electrode and a plurality of insulating pillars for separating said electrodes, comprising the steps of:
- providing said electrodes;
- forming a mold having grooved wall cavities;
- molding dielectric pillars in said cavities, said pillars having grooved outer surfaces;
- adhering said pillars to one of said electrodes;
- and
- finishing said device.
Dependencies are inferred from the claim text.