Modular jack assembly
AssigneeMaxconn Incorporated
InventorGregory Loudermilk
Life of this patent
Estimating the term…
Loading patent…
AssigneeMaxconn Incorporated
InventorGregory Loudermilk
Estimating the term…
A modular jack assembly includes a housing having a plug-receiving cavity and an LED assembly attached atop the plug receiving cavity. In a preferred embodiment, the LED assembly is integrally formed with the housing. The LEDs are encased within the LED assembly, being separated from the plug-receiving cavity by a partition. This isolation of the LED helps to minimize the coupling of EMF interference radiated by the leads of the LED while they are operating to the underlying contact pins. Contact pins disposed within the plug-receiving cavity each have a contacting portion which extends along the roof of the cavity. The contacting portions have a varying measure of separation from the roof along their extent. This provides further separation from the LED leads which are disposed above the contact pins in the LED assembly, further lessening the EMF coupling with the LED leads. In an alternate embodiment, the modular jack has a stacked form factor and can be ganged to form a bank of modular jacks.
A modular jack for receiving a plug comprising:
A modular jack comprising:
A ganged modular jack assembly comprising:
A stacked modular jack adapted for mounting on a printed circuit board, said stacked modular jack comprising:
Dependencies are inferred from the claim text.