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US 5,703,752 AGranted
Heat dissipating apparatus for a semiconductor device for use in a motor drive
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorSuk Ha Woo
Life of this patent
Estimating the term…
Abstract
A heat dissipating apparatus for a semiconductor device for use in a motor drive that improves heat dissipation efficiency by transferring heat from the semiconductor device directly to a heat sink, using ground leads or nonconnection leads of element lead pins. In addition, it is possible to connect the semiconductor device to the heat sink without extra fixing members
Claims16
A heat dissipating apparatus for a semiconductor device for use in a motor drive, comprising:
- a printed circuit board having an upper surface on which a semiconductor device having a plurality of leads on its package is mounted wherein at least some of said plurality of leads are heat dissipation leads;
- a separate heat dissipating member attached to a bottom surface of said printed circuit board and located totally therebelow for dissipating heat from said semiconductor device;
- said printed circuit board having holes formed of a predetermined diameter in said printed circuit board for receiving said heat dissipation leads;
- and
- said heat dissipating member having holes formed of a predetermined diameter so that said heat dissipating leads received by said printed circuit board are in direct physical contact with walls of said holes formed in said heat dissipation member.
2 more elements
The heat dissipating apparatus for a semiconductor device for use in a motor drive, comprising:
- a printed circuit board having an upper surface on which a semiconductor device having a plurality of leads on its package is mounted;
- a separate heat dissipating member attached to a bottom surface of said printed circuit board and located totally therebelow to dissipate heat generated from said semiconductor device wherein at least some of said plurality of leads are heat dissipation leads;
- said printed circuit board having holes formed of a predetermined diameter in said printed circuit board leads for receiving said heat dissipation leads;
- and
- said heat dissipating member having upstanding ribs and adjacent corresponding holes formed so that said heat dissipating leads received by said printed circuit board are in direct physical contact with walls of said holes formed in said heat dissipation member.
2 more elements
Dependencies are inferred from the claim text.