Interconnection structure for attaching a semiconductor device to a substrate
AssigneeLG Semicon Co., Ltd.
InventorDae Soon Kang
Life of this patent
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Abstract
An interconnection structure for bonding a semiconductor device on a substrate includes a semiconductor chip having a plurality of solder balls attached thereto; and an under-fill substance layer being adjacently bonded to the semiconductor chip and having a plurality of holes therein. By employing the structure, when the semiconductor chip and the substrate are electrically bonded, a previously provided under fill substance layer is used without any additional under filling step, so that the entire process can be simplified and its reliability can be improved.
Claims9
A module for mounting a semiconductor device on a substrate, the semiconductor device having a plurality of conductive media for conductive connection to the substrate, comprising:
- an interconnection structure having a plurality of holes for receiving said plurality of conductive media to allow a conductive connection between the semiconductor device and the substrate, wherein said interconnection structure is in contact with said semiconductor device and the substrate to adhesively bond the semiconductor device to the substrate.
Dependencies are inferred from the claim text.