US 5,703,399 AGranted

Semiconductor power module

AssigneeMitsubishi Denki Kabushiki Kaisha

InventorsGourab Majumdar, Tooru Iwagami, Sukehisa Noda

Life of this patent

Estimating the term…

Loading patent…

Abstract

A blanked lead frame serves both as an interconnection pattern for a control circuit and a power circuit and as external terminals. Highly heat conducting resin having an electric insulating property is put between the lead frame and the heat sink arranged to face each other to maintain good thermal conductivity therebetween. The heat sink and the lead frame are coupled easily and fixedly by performing a simple process of sealing with the highly heat conducting resin. Accordingly, no expensive circuit boards are required, which have been necessary in conventional devices, nor a process of patterning the interconnection pattern and a process of connecting the external terminals to the interconnection pattern when manufacturing the device required. That is to say, the manufacturing cost is reduced without deteriorating the heat radiating characteristic.

Claims20

Dependent claims

A semiconductor power module incorporating circuits of a power circuit having a power semiconductor element and a control circuit for controlling the power semiconductor element, comprising:

a lead frame having a first main surface and a second main surface, which forms an interconnection pattern having respective portions on which each of said power circuit and control circuit are formed and which includes external terminals for making electric connection to each of said power circuit and control circuit, wherein all of circuit elements of each of said power circuit and control circuit are respectively affixed on said first main surface;
a heat sink with thermal conductivity facing at least a first portion of said second main surface of said lead frame at which the power circuit is formed;
and
a first sealing resin with an electric insulating property and thermal conductivity filling a gap between said lead frame and said heat sink to electrically insulate said lead frame and said heat sink from each other and fixedly couple said lead frame and said heat sink.

1 more element

Dependencies are inferred from the claim text.