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US 5,703,398 AGranted
Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
AssigneeFujitsu Limited
InventorsMichio Sono, Kazuto Tsuji, Hideharu Sakoda, Yoshimi Suzuki, Masao Sakuma
Life of this patent
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Abstract
A semiconductor integrated circuit device includes a semiconductor chip supported by a stage, leads electrically connected to the semiconductor chip, first and second heat radiating members provided on first and second sides of the semiconductor chip, and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.
Claims15
A semiconductor integrated circuit device comprising:
- a semiconductor chip supported by a stage;
- leads electrically connected to the semiconductor chip;
- first and second heat radiating members provided on first and second sides of the semiconductor chip;
- heat conducting supporting members, supporting the first and second heat radiating members away from the stage;
- and
- a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.
3 more elements
A semiconductor integrated circuit device comprising:
- a semiconductor chip supported by a stage;
- leads electrically connected to the semiconductor chip;
- first and second heat radiating members provided on first and second sides of the semiconductor chip;
- a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members;
- and
- supporting members supporting the first and second heat radiating members from the stage;
- wherein the supporting members include upper supporting members provided on the side of the first heat radiating member and lower supporting members provided on the side of the second heat radiating member;
- and
- wherein the stage and the lower supporting members are integrally formed.
6 more elements
A semiconductor integrated circuit device comprising:
- a semiconductor chip supported by a stage;
- leads electrically connected to the semiconductor chip;
- first and second heat radiating members provided on first and second sides of the semiconductor chip;
- a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members;
- and
- a relay member having terminals, and wherein
- the leads are electrically connected to the semiconductor chip via the terminals of the relay member.
4 more elements
Dependencies are inferred from the claim text.