Integrated electro-optical package

An integrated electro-optical package comprising:

• a supporting substrate;
• a first layer of conductive material patterned on the supporting substrate:
• a continuous layer of organic material overlying the first layer of conductive material;
• a second layer of conductive material patterned orthogonal to the first layer of conductive material and overlying the continuous layer of organic material, thereby defining a plurality of pixels of an organic light emitting device;
• a printed circuit board positioned to overlay the second layer of conductive material, and containing thereon at least one driver and control circuit and having formed therein a plurality of plated through hole vias;
• a conductive epoxy, positioned to electrically interconnect the plurality of pixels defined by the first layer of conductive material and the second layer of conductive material with the at least one driver and control circuit;
• and
• a sealant positioned to hermetically seal the organic light emitting device to the printed circuit board.