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US 5,703,393 AGranted
Semiconductor pressure detecting device and manufacturing method of the device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYasuo Yamaguchi
Life of this patent
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Abstract
A semiconductor pressure detecting in which a pressure sensing element (2) made of semiconductor having a diaphragm portion (9), a pedestal (8) for supporting the pressure sensing element (2) and wires (5) connected to the pressure sensing element (2) are molded by a molding resin (6) not so as to mold the diaphragm portion (9), characterized in that a silicon resin layer (4) is adhered on an outer surface of the diaphragm portion (9).
Claims6
A semiconductor pressure detecting device comprising:
- a semiconductor pressure sensing element including a diaphragm portion;
- a pedestal supporting said semiconductor pressure sensing element;
- at least one wire connected to said semiconductor pressure sensing element;
- a molding resin adhesion prevention member including a silicone resin layer adhered on a whole outer surface of said semiconductor pressure sensing element so as to prevent molding resin from contacting said diaphragm portion during molding of said semiconductor pressure sensing element, said pedestal, and said at least one wire.
1 more element
A semiconductor pressure detecting device comprising:
- a semiconductor pressure sensing element including a diaphragm portion;
- a pedestal supporting said semiconductor pressure sensing element;
- at least one wire connected to said semiconductor pressure sensing element;
- a molding resin adhesion prevention member including a silicone resin layer adhered on an outer surface of said diaphragm portion so as to prevent molding resin from contacting said diaphragm portion during molding of said semiconductor pressure sensing element, said pedestal, and said at least one wire.
1 more element
Dependencies are inferred from the claim text.