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US 5,703,388 AGranted
Double-poly monos flash EEPROM cell
AssigneeMosel Vitelic, Inc.
InventorsChih-Hsien Wang, Min-Liang Chen, Thomas Chang
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Abstract
The present invention discloses a double poly metal oxide.backslash.nitride.backslash.oxide semiconductor electrically erasable programmable read only memory (EEPROM) for use in semiconductor memories. The EEPROM structure includes a select gate, an oxide.backslash.nitride.backslash.oxide layer, and a control gate. The control gate is formed on the oxide.backslash.nitride.backslash.oxide layer. A lightly doped drain (LDD) structure is formed adjacent to the drain and underneath the control gate.
Claims6
A double-poly MONOS EEPROM formed on a semiconductor substrate, said EEPROM comprising:
- a source formed in said substrate;
- a drain formed in said substrate;
- a gate oxide layer formed on said semiconductor substrate adjacent to said source and drain, said gate oxide layer being spaced apart from said drain by a first spacing width, said gate oxide layer being spaced apart from said source by a second spacing width;
- a select gate formed on said gate oxide layer;
- a dielectric layer formed on a portion of said select gate, a portion of said drain, and said first spacing width, said second spacing width being exposed by said select gate and said dielectric layer, said dielectric layer used to store carriers, said carriers tunneling into said dielectric layer via said first spacing width in a programming mode, wherein said select gate is used for conserving power in an erase mode;
- and
- a control gate formed on said dielectric layer.
4 more elements
Dependencies are inferred from the claim text.