Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
AssigneeStaktek Corporation
InventorCarmen D. Burns
Life of this patent
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Abstract
A method for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications.
Claims56
A method of manufacturing a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising the steps of:
- attaching at least one integrated circuit chip in a ceramic housing comprising a base, wire bond pads and seal ring, said integrated circuit chip having a face with circuit connection pads thereon and positioned wherein the face is accessible from within said ceramic housing;
- connecting said ceramic housing wire bond pads to said integrated circuit connection pads;
- attaching a cover to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- attaching a lead frame to said ceramic housing base, said lead frame having a plurality of electrical conductors that are fixedly aligned with said housing wire bond pads;
- and
- connecting said lead frame conductors to said housing wire bond pads.
A method of manufacturing a hermetically sealed ceramic integrated circuit package having a standard size and housing various sizes of integrated circuit chips with connections thereto made by means of a first lead frame laminated onto the face of the chip, the package having good thermal conductivity for efficiently transferring heat from the integrated circuit chip die contained therein, comprising the steps of:
- attaching at least one integrated circuit chip having an active face and having a first lead frame laminated to said active face in a ceramic housing comprising a base, bond pads and seal ring, said integrated circuit first lead frame having a plurality of conductors connected to connection pads of said integrated circuit chip and positioned wherein said first lead frame is accessible from within said ceramic housing;
- connecting said ceramic housing bond pads to said first lead frame conductors;
- and
- attaching a cover to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
A method of manufacturing a lead frame on an integrated circuit package of a type having at least one substantially planar major exterior surface, said method comprising the steps of:
- mounting a lead frame comprised of a plurality of conductive elements formed in a substantially planar thermally conductive element to a first exterior major surface of an integrated circuit package, said package having a plurality of circuit conductors;
- and
- connecting selected ones of said lead frame conductors to selected ones of said integrated circuit package circuit conductors.
A method of manufacturing a lead frame on an integrated circuit package of a type having upper and lower substantially planar exterior major surfaces, said method comprising the steps of:
- mounting a first lead frame comprised of a plurality of conductive elements formed in a substantially planar thermally conductive element to said upper major surface of an integrated circuit package, said package having a plurality of circuit conductors;
- mounting a second lead frame comprised of a plurality of conductive elements formed in a substantially planar thermally conductive element to said lower exterior major surface of said integrated circuit package;
- and
- connecting selected ones of lead frame conductors of said first and second lead frames to selected ones of said integrated circuit package circuit conductors.
A method of manufacturing a lead frame on an integrated circuit package of a type having upper and lower substantially planar exterior major surfaces, said method comprising the steps of:
- mounting a heat spreader in heat exchange relationship to said upper major surface of an integrated circuit package, said package having a plurality of circuit conductors;
- mounting a lead frame comprised of a plurality of conductive elements formed in a substantially planar thermally conductive element to said upper major surface of said heat spreader;
- and
- connecting selected ones of said lead frame conductors to selected ones of said integrated circuit package circuit conductors.
Dependencies are inferred from the claim text.