Microelectronic device package and method

A frequency selection component packaged by a method for packaging a acoustic wave device, said method comprising steps of:

• providing a first material on an active surface of said acoustic wave device, said first material having a first temperature coefficient of expansion of one hundred parts per million per degree Centigrade or more;
• treating said first material to provide enhanced adhesion to said second material, wherein said treating step includes exposing said first material to ultraviolet radiation;
• heating said acoustic wave device and said first material to a predetermined first temperature in a range of from 100 to 250 degrees Centigrade;
• molding a second material about said acoustic wave device and said first material, said second material having a second temperature coefficient of expansion less than thirty parts per million per degree Centigrade;
• and
• cooling said first material, said second material and said acoustic wave device to provide a packaged acoustic wave device including a void between said acoustic wave device and said first material.

An acoustic wave device packaged by a method comprising steps of:

• providing a first material on an active surface of said acoustic wave device, said first material having a first temperature coefficient of expansion of one hundred parts per million per degree Centigrade or more;
• treating said first material to provide enhanced adhesion to said second material, wherein said treating step includes exposing said first material to ultraviolet radiation;
• heating the acoustic wave device and the first material to a predetermined first temperature in a range of from 100 to 250 degrees Centigrade;
• molding a second material about said acoustic wave device and said first material, said second material having a second temperature coefficient of expansion less than thirty parts per million per degree Centigrade;
• and
• cooling said first material, said second material and said acoustic wave device to provide a packaged acoustic wave device including a void between said acoustic wave device and said first material.