Method for selectively electroplating apertured metal or metallized products

A method for selectively electroplating apertured metal or metallized products obtained by stamping or etching, the method comprising the steps of:

• continuously transporting apertured products through a photoresist bath during operation, while the products are connected to a power source at least from a time the apertured products enter the bath until the apertured products exit from the bath, so as to electrophoretically apply a fully closed photoresist layer to the apertured products;
• covering the apertured products after a drying of the photoresist layer with at least one photomask at desired locations;
• exposing the apertured products covered with the at least one photomask;
• removing the photoresist layer by means of a developing process from parts of the apertured products to be electroplated after removal of the at least one photomask, while a remaining part of the photoresist layer on the apertured products serves as a mask for the apertured products;
• and
• electroplating those parts of the apertured products from which the photoresist layer has been removed, wherein the electroplating step comprises transporting the products through a bath for plating the products with a metal, anodes being arranged one behind the other in said bath, as seen in a direction of travel through said bath for plating the products and partitions being disposed between said anodes, and wherein said anodes are successively connected to means for controlling and energizing the anodes dependent on the travel of the products through the bath.

A method for selectively electroplating apertured metal or metallized products obtained by stamping or etching, the method comprising the steps of:

• continuously transporting apertured products through a photoresist bath during operation, while the products are connected to a power source at least from a time the apertured products enter the bath until the apertured products exit from the bath, so as to electrophoretically apply a fully closed photoresist layer to the apertured products;
• covering the apertured products after a drying of the photoresist layer with at least one photomask at desired locations;
• exposing the apertured products covered with the at least one photomask;
• removing the photoresist layer by means of a developing process from parts of the apertured products to be electroplated after removal of the at least one photomask, while a remaining part of the photoresist layer on the apertured products serves as a mask for the apertured products;
• and
• electroplating those parts of the apertured products from which the photoresist layer has been removed;
• wherein the exposing step comprises the steps of:
• moving the photomask from a starting position to a preselected reference position on said products, the photomask being used for exposing the apertured products and being opaque at desired locations;
• moving the photomask in a direction substantially perpendicular to a direction of movement of the products during said exposing step to lightly press the photomask against the products;
• moving the photomask along with the products in a direction parallel to the direction of movement of the products during said exposing step;
• and
• moving the photomask away from the products and in a direction opposite to the direction of movement of the products during said exposing step.