Silicon semiconductor wafer solar cell and process for producing said wafer
AssigneeSiemens Solar GmbH
InventorsArthur Endros, Giuliano Martinelli
Life of this patent
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Abstract
A silicon semiconductor wafer is constructed from three mutually inclined monocrystalline regions (6, 7, 8) which form three circular sectors of the wafer whose interfaces and boundary lines consequently extend radially with respect to one another and form angles (W6, W7, W8) of less than 180.degree. with one another. In this arrangement, two of the interfaces are first-order twin grain boundaries between two <111> crystal planes in each case. The silicon semiconductor wafer is used to produce inexpensive high-performance solar cells.
Claims11
A solar cell comprising:
- a mechanically robust 60 .mu.m to 90 .mu.m thick silicon semiconductor wafer as a solar cell substrate, said wafer having a front side and a rear side, and said wafer having three mutually inclined monocrystalline regions which form three circular sectors whose interfaces and boundary lines extend radially with respect to one another and form angles of less than 180.degree. with one another, two of the interfaces being first-order twin grain boundaries between two <111>
- crystal planes in each case, the wafer being produced from crucible-drawn silicon;
- a light p-doping in the wafer;
- a shallow, n+-doped emitter 0.2 .mu.m to 2 .mu.m deep on the front side;
- a first passivation layer on the front side, the first passivation layer being an oxide layer which produces a charge carrier recombination rate on the surface of said wafer of less than 1000 cm/s;
- a second passivation layer or a back surface field on the rear side, the charge carrier recombination rate on the rear side being less than 100 cm/s;
- and
- current-collecting contacts respectively on the front and rear sides.
A process for producing a silicon semiconductor wafer for a solar cell substrate having three mutually inclined circular-sector-shaped monocrystalline regions, comprising the steps of:
- producing three octahedral seed crystals by sawing the crystals out of a conventional <110>-oriented monocrystal such that all octahedral surfaces are identical with <111>
- crystal planes;
- joining two of the seed crystals by laying the two seed crystals on top of one another and fixing the two seed crystals with a wire so that a first-order twin grain boundary is formed;
- growing, utilizing the two joined seed crystals, a bicrystal using a crystal growing process;
- sawing a wedge-shaped piece out of the bicrystal and in this process a <111>
- plane of the two half-crystals is laid bare in each case;
- inserting the third seed crystal into the wedge-shaped gap such that a second first-order twin grain boundary is formed with the <111>
- crystal surface;
- shortening the bicrystal to approximately a length of the third seed crystal to form a tricrystal seed;
- pulling a tricrystal ingot from a silicon melt utilizing a crystal growing process using the tricrystal seed;
- and
- sawing the semiconductor wafer out of the tricrystal ingot using a wire saw.
Dependencies are inferred from the claim text.