Ultra low profile board-mounted modular jack

An arrangement of a modular jack and a circuit board, comprising:

• a modular jack including at least an insulative housing having board-mounting sections and a plurality of contact members retained therein and having board-connecting sections extending from said housing, and a circuit board having a top surface and an edge and a plurality of conductive sites corresponding to respective said board-connecting sections of said contact members, and further having mounting apertures cooperable with said board-mounting sections of said housing, said board-mounting sections of said housing and said board-connecting sections of said contact members depending below a board-mounting face of said housing abuttable against said top surface of said circuit board;
• said modular jack defining a plug-receiving cavity extending inwardly from a mating face, and said contact members including respective contact sections extending into said plug-receiving cavity to be engaged by corresponding contacts of a mating plug connector received into said plug-receiving cavity, and said modular jack further including a bottom section defining at least a latch arm channel adjoining said plug-receiving cavity and extending rearwardly from said mating face at least to rearwardly facing latch surfaces;
• said bottom section of said housing extending below said board-mounting face thereof forwardly of said board-connecting sections of said contact members, and said circuit board defining a recess extending inwardly from said edge complementary to said bottom section of said housing, to receive thereinto at least said bottom section of said housing,
• whereby the height of a top surface of said modular jack above said top surface of said circuit board is minimized.