Device for moving an object by means of thermal change in shape or volume
OwnerHelmut Walter Leichtinventor
Life of this patent
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Abstract
The invention provides a device for moving an object by means of thermal change in shape or volume, such that the object is moved when a predetermined process temperature has been reached. Preferably the device can be used in a soldering system on a printed circuit board. The advantage of the invention lies in a temperature-controlled movement of the object with a high-level precision that, for example, ensures a very sparing unsoldering.
Claims12
A device for moving an electronic component on a circuit board by a process temperature during unsoldering or soldering in the vapor-phase by means of thermal change in shape or volume when a predetermined process temperature at or above the melting point of the solder has been reached, comprising a closed container (1) filled with a fluid or a solid body, a free end (2) of the container or solid body is connected with the electronic component, wherein the volume of the fluid or solid body is increased under the influence of the predetermined process temperature, so that the free end (2) of the container (1) or solid body is pushed from a starting position (A) and the electronic component is moved relative to the printed circuit board.
A process for moving an electronic component on a printed circuit board solely by a process temperature during unsoldering or soldering by means of a thermal change in shape or volume when a predetermined process temperature at or above the melting point of the solder has been reached, said process comprising:
- providing a closed container (1) filled with a fluid or a solid body, a free end (2) of the container or solid body being connected at a starting position (A) with the electronic component (4), and
- increasing the volume of the fluid in the container or the shape of the solid body by said process temperature whereby said free end of the container or solid body is pushed from the staring position and the electronic component is thereby moved relative to the printed circuit board when the predetermined process temperature has been reached.
Dependencies are inferred from the claim text.