Acoustic wave device manufacturing method

A method for identifying which transducers are defective in a die for an acoustic wave device and for preventing pyroelectric fracture, said method comprising steps of:

• (a) providing a substrate suitable for acoustic wave devices;
• (b) processing said substrate to provide a patterned metallization thereon, said patterned metallization comprising a plurality of die each including an acoustic wave filter pattern, each said acoustic wave filter pattern comprising a plurality of N many interdigital acoustic wave transducers and a plurality of M many resistor patterns, wherein M.ltoreq.N, and further wherein each of said M many resistor patterns includes a resistance greater by at least an order of magnitude than an end-to-end resistance of an electrode of any of said N many interdigital acoustic wave transducers;
• (c) measuring a resistance across a selected transducer pattern within each die of said plurality of die;
• (d) comparing the resistance thus measured to a table of predetermined resistance values, wherein selected values of resistance correspond to specific defects in the patterned metallization;
• and
• (e) identifying defective die on said substrate from said comparing step.

A method for identifying which transducers are defective in a die for an acoustic wave device and for preventing pyroelectric fracture, said method comprising steps of:

• (a) providing a substrate suitable for acoustic wave devices;
• (b) processing said substrate to provide a patterned metallization thereon, said patterned metallization comprising a plurality of die each including an acoustic wave filter pattern, each said acoustic wave filter pattern comprising a plurality of N many interdigital acoustic wave transducers and a plurality of M many resistor patterns, wherein M.ltoreq.N;
• (c) measuring a sheet resistance associated with the acoustic wave filter pattern;
• (d) determining a resistance of a test pattern associated with said acoustic wave filter pattern to provide a measured resistance;
• (e) computing an estimated average linewidth for said acoustic wave filter pattern from said measured resistance and said sheet resistance;
• (f) comparing the estimated average linewidth thus measured to a table of predetermined linewidth values, wherein selected values of linewidth correspond to acceptable linewidths;
• (g) identifying defective die on said substrate from said step (f);
• (h) measuring a resistance across a selected transducer pattern within each die of said plurality of die;
• (i) comparing the resistance thus measured to a table of predetermined resistance values, wherein selected values of resistance correspond to specific defects in the patterned metallization;
• and
• (j) identifying defective die on said substrate from said step (i).

A method for identifying which transducers are defective in a die for an acoustic wave device and for preventing pyroelectric fracture, said method comprising steps of:

• (a) providing a substrate suitable for acoustic wave devices;
• (b) processing said substrate to provide a patterned metallization thereon, said patterned metallization comprising a plurality of die each including an acoustic wave filter pattern, each said acoustic wave filter pattern comprising a plurality of N many interdigital acoustic wave transducers and a plurality of M many resistor patterns, wherein M.ltoreq.N, and further wherein each of said M many resistor patterns includes a resistance greater by at least an order of magnitude than an end-to-end resistance of an electrode of any of said N many interdigital acoustic wave transducers, said M many resistor patterns disposed in such a fashion that all of said N many transducer patterns are provided with a DC connection from one bus bar to another bus bar of said transducer patterns;
• (c) measuring a resistance across a selected transducer pattern within each die of said plurality of die;
• (d) comparing the resistance thus measured to a table of predetermined resistance values, wherein selected values of resistance correspond to specific defects in the patterned metallization;
• and
• (e) identifying defective die on said substrate from said comparing step.