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AssigneeSumitomo Chemical Company, Limited
InventorsKozo Kotani, Toshio Kawakita, Taiichi Sakaya, Toshiya Kuroda
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A gas barrier resin composition or its film having very high level gas barrier and moisture barrier properties, which includes at least a high hydrogen-bonding resin and a non-film-forming inorganic laminar compound having a particle size of 5 .mu.m and an aspect ratio of 50-5,000. The resin composition or its film can be produced by dispersing a non-film-forming inorganic laminar compound in a high hydrogen-bonding resin or resin solution in such a state that the non-film-forming inorganic laminar compound is swollen or cloven with a solvent, and removing the solvent from the dispersion, if necessary in the form of a film, while maintaining the state.
A resin composition comprising a high hydrogen-bonding resin containing from 20 wt % to 60 wt % of a hydrogen-bonding group or ionic group based on a total weight of the hydrogen-bonding resin, and a non-film-forming clay mineral having a swellability, the resin composition having a volume ratio of the clay mineral to the hydrogen-bonding resin in the range of 5:95 to 90:10, wherein the clay mineral has an aspect ratio of in a range of from 50 to 5000.
A water-resistant gas-barrier film formulated at least from a resin composition, said resin composition comprising a high hydrogen-bonding resin containing from 20 wt % to 60 wt % of a hydrogen-bonding group or ionic group based on a total weight of the hydrogen-bonding resin, and a non-film-forming clay mineral having a swellability, the resin composition having a volume ratio of the clay mineral to the hydrogen-bonding resin in the range of 5:95 to 90:10 wherein the clay mineral has an aspect ratio of in a range of from 50 to 5000.
Dependencies are inferred from the claim text.